Fine Chemicals,Food Additives, Cosmetic Materials

In advanced materials engineering, N‑phenylmaleimide (N‑PMI) manuafctured by Yangchen Tech has emerged as a high‑performance monomer for imparting exceptional heat resistance, dimensional stability, and mechanical robustness to a wide range of polymer composites. By introducing a rigid five‑membered maleimide ring with a phenyl substituent, N‑PMI elevates thermal decomposition thresholds, raises Vicat softening points, and improves tensile and flexural properties across ABS, PVC, Nylon 6, epoxy, and polyimide systems.

Why choose N‑Phenylmaleimide?

N‑Phenylmaleimide features a planar cyclic imide core that resists chain scission at elevated temperatures, pushing onset decomposition temperatures 20–30 °C higher than conventional styrenic copolymers . Its phenyl ring further imparts steric hindrance, reducing segmental mobility and boosting glass transition temperatures (Tg) by up to 15 °C in polymer blends .

Specification

Appearance Melting point Purity Solubility
Yellow crystalline powder or flakes 85-90℃ ＞99% Soluble in organic solvents

Basic Information

Chemical Structure
Chemical Formula C10H7NO2
CAS No. 941-69-5
Molecular Weight 173.16
Packing Type Paper bag (20 kg)
Properties Yellow crystalline powder or needles

Core Applications in Polymer Composites

ABS Composites
In ABShttps://www.yangchentech.comNSM (N‑PMI‑styrene‑maleic anhydride) terpolymers, just 10 wt % N‑PMI elevates heat distortion temperatures (HDT) from ~100 °C to 130 °C, while also increasing tensile strength by 10–15 % and Rockwell hardness by 20 % . Such improvements enable under‑the‑hood automotive parts to maintain dimensional integrity under prolonged high‑temperature exposure .

PVC & PMMA Systems
In PVC‑ABS blends, N‑PMI acts as both a heat‑stabilizer and flame‑retardant, helping formulations meet UL‑94 V‑0 ratings by reducing thermal oxidation and dripping under fire tests .Similarly, incorporating 5–15 wt % N‑PMI in PMMA raises Vicat softening points by 10–20 °C, enhancing optical disc substrates and lighting components for sustained high‑temperature service.

Epoxy & Electronics
When used in epoxy formulations, N‑PMI enhances chemical resistance and reduces warpage under thermal cycling, crucial for printed circuit board encapsulation and high‑power electronics housings. Its inherent flame‑retardancy also helps systems achieve UL‑94 V‑0 compliance without halogenated additives.

Mechanisms of Heat‑Resistance Enhancement
1. Rigid Segments & Cross‑Linking: The maleimide ring creates localized rigidity and potential crosslinks that impede chain mobility, directly lifting glass transition and Vicat points.
2. Thermal Decomposition Delay: Steric hindrance from the phenyl substituent raises the onset of thermal degradation by 20–30 °C, as shown in TGA curves where N‑PMI copolymers retain >90 % mass at 300 °C .
3. Flame Retardancy: The cyclic imide structure promotes char formation and limits dripping, underpinning UL‑94 V‑0 ratings in PVC and epoxy systems .

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2025-04-25

What is the application of Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane in Epoxy Resins?

Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane (CAS 105391-33-1), a highperformance bismaleimide (BMI) monomer manufactured by Yangchen Tech, has emerged as a gamechanger in advanced polymer science. Its unique chemical structure and thermal stability make it a critical additive for enhancing epoxy resin systems. At Yangchen Tech, we specialize in synthesizing this compound with precision, leveraging over two decades of expertise to meet the demanding needs of industries ranging from aerospace to electronics.

Specification

Test Specifications

Appearance White powder

Purity (HPLC) min. 97.0 area%

Purity (with Total Nitrogen) min. 98.0 %

Melting point 163.0 to 167.0 °C

Storage Conditions Cool and dry place

Role in Epoxy Resin Formulations

Epoxy resins are widely used for their mechanical strength and chemical resistance, but their performance in extreme environments often requires modification. Here’s how this BMI monomer elevates epoxy systems:

1. Thermal Stability Enhancement

The compound’s melting point of 165°C and predicted boiling point of 618.7°C ensure compatibility with hightemperature curing processes.

When blended with epoxy resins, it forms crosslinked networks that significantly raise the glass transition temperature (*Tg*). For instance, formulations incorporating >98% pure BMI from Yangchen Tech achieve *Tg* values exceeding 250°C, compared to standard epoxy systems (~150°C).

This thermal resilience is critical for aerospace composites exposed to rapid temperature fluctuations.

2. Mechanical Reinforcement

The rigid aromatic backbone of the BMI monomer improves flexural strength and modulus. Testing shows a 20–30% increase in tensile strength in epoxyBMI blends compared to unmodified resins.

Applications include structural adhesives for automotive and wind turbine components, where fatigue resistance is paramount.

3. Improved Chemical Resistance

The crosslinked matrix formed by BMIepoxy hybrids demonstrates superior resistance to solvents, acids, and moisture. This is vital for electronic encapsulation materials protecting sensitive circuitry in harsh environments.

Case Studies & Performance Data

Case 1: HighTemperature Adhesives for Electronics

A leading semiconductor manufacturer utilized Yangchen Tech’s BMI monomer to develop an epoxy adhesive for chip encapsulation. Key results:

Heat Resistance: Withstood 300°C for 500 hours without delamination.

Dielectric Properties: Maintained a dielectric constant below 3.2 at 1 MHz, ideal for highfrequency applications.

Case 2: Aerospace Composite Matrices

In collaboration with a composite material developer, Yangchen Tech’s BMIenhanced epoxy resin achieved:

Weight Reduction: 15% lighter than traditional systems due to reduced filler requirements.

Flame Retardancy: Passed UL94 V0 standards, crucial for aircraft interiors.

Technical Advantages of Yangchen Tech’s BMI Monomer

1. Superior Purity & Consistency

Our proprietary purification process delivers >98% HPLC purity, minimizing side reactions during epoxy curing.

Batchtobatch consistency is ensured through NMR and mass spectrometry validation.

2. Tailored Solutions for Industrial Scaling

Yangchen Tech offers customizable purity grades (97–99%) and bulk packaging (1KG to 25KG) to align with production needs.

With a 500kg/month production capacity, we support both R&D prototyping and largescale manufacturing.

3. Regulatory Compliance

Fully compliant with REACH, TSCA, and OSHA standards, including comprehensive SDS and CoA documentation.

Why Partner with Yangchen Tech?

20+ Years of Expertise: Deep domain knowledge in maleimide chemistry and epoxy formulations.

EndtoEnd Support: From formulation optimization to regulatory guidance.

Global Logistics: Reliable delivery with expedited shipping options.

Data sourced from validated industry testing and Yangchen Tech’s internal R&D reports. For detailed specifications or collaboration inquiries, contact :business@xysjgm.com
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2025-04-25

What is the role of Phenylmethane maleimide in PCB Laminate Formulations

The growing demand for high-performance printed circuit boards (PCBs) has led formulators to seek advanced resin systems that deliver superior thermal, mechanical, and dielectric properties. Phenylmethane maleimide, traded as BMI-200 (CAS 67784-74-1) and also available from Yangchen Tech as BMI-2300 to some Japanese companies, is a modified bismaleimide resin that directly addresses these needs. By adding BMI-200 to copper clad laminates (CCLs), formulators can achieve higher glass transition temperatures (Tg), lower dielectric losses, enhanced dimensional stability, and better copper adhesion, ultimately extending the life and reliability of PCBs in demanding applications such as telecommunications, automotive electronics, and aerospace systems.

1. Overview of Phenylmethane Maleimide (BMI-200)

1.1 Chemical Properties and Structure

Chemical Name: Phenylmethane Maleimide

CAS: 67784-74-1

Appearance:

1.2 Key Performance Characteristics

Thermal Stability: BMI-200 maintains integrity at temperatures above 250°C, minimizing discoloration and degradation of the resin during PCB multilayer lamination

High Glass Transition Temperature (Tg): Addition of BMI-200 significantly increases the Tg of the laminated material, ensuring dimensional stability under thermal cycling conditions.

Mechanical Strength: BMI-200 provides high modulus and stiffness, reducing CTE mismatch between copper and resin, thereby mitigating warpage and delamination.

Chemical Resistance: BMI-200 has excellent resistance to solvents, acids, and moisture, ensuring signal integrity in harsh environments.

Technical Indicators

Appearance Softening point Acid value
Solubility

Brownish-yellow lumps 83℃
2.42

Clear and transparent

Solubility

Solvent ACETONE MEK THF DMF NMP TOLUENE

BMI-2300(ref) 50-80 60-80 20-100 ＜80 ＜50 Insoluble

2. Impact on CCL Performance

2.1 Increased Glass Transition Temperature (Tg)

A higher Tg of a CCL means that the CCL maintains good mechanical strength at elevated temperatures. If formulated correctly, BMI-200 oligomers can increase Tg to over 210°C, surpassing many standard epoxies.

2.2 Enhanced Dielectric Performance

Low dissipation factor (Df) and stable dielectric constant (Dk) are critical for high-speed signal transmission. BMI-200-based laminates have low Df aging rates and controlled dielectric constant temperature coefficients, ensuring minimal signal distortion in the RF and microwave domains.

2.3 Dimensional and Mechanical Stability

The high crosslink density imparted by the maleimide groups results in low thermal expansion (Z-axis CTE <1.3%), minimizing interlaminar stress and copper delamination degradation during thermal cycling. Higher copper foil adhesion (>1 N/mm) also improves reliability under mechanical vibration and thermal shock.

2.4 Long-term reliability

BMI-200's inherent chemical stability and mechanical integrity extend the life of PCBs. Laminates containing BMI-200 exhibit minimal dendritic delamination patterns and stable interconnect stress test results during long-term aging.

3. Applications in Advanced PCB Technologies

High-frequency RF and microwave PCBs: Ideal for telecommunications, satellite communications, and 5G infrastructure due to low dielectric loss and stable dielectric constant (Dk).

Automotive electronics: Withstands high temperatures in the engine compartment and supports lead-free soldering processes without resin degradation.

Aerospace and defense: High Tg and radiation resistance make BMI-200 laminates suitable for avionics and radar systems.

4. Why choose Yangchen Technology's BMI-200 powder?

Yangchen Technology Factory is a leading manufacturer of high-performance resin materials in China. The production process of its BMI-200 phenylmethane maleimide powder follows strict quality control to ensure:

Guaranteed purity (≥98%): Minimizes unwanted side reactions and ensures consistent laminate performance

Customized particle size distribution: Optimizes dispersion in the resin matrix for uniform cure and mechanical strength

Customizable batch production: Supports different oligomerization levels and functionalization levels to meet specific copper clad laminate (CCL) requirements

Full technical support: Expert guidance on formulation, process parameters and performance testing

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2025-04-25

Why Polyimide Resin can be used in high-temperature adhesive ?

Polyimide resin powder manufactured by Yangchen Tech is a high-performance polymer that is synthesized through a condensation reaction. Its unique molecular structure provides it with excellent resistance to high temperatures, chemicals, and radiation. Unlike traditional adhesives that degrade under extreme heat, polyimide resin powder maintains its integrity, making it the go-to choice for applications where durability under harsh conditions is non-negotiable.

Key Performance Characteristics Of Polyimide Resin Manufactured By Yangchen Tech

High-Temperature Stability: Polyimide resin powder exhibits minimal thermal expansion and retains its mechanical strength even when exposed to temperatures exceeding 500°F (260°C). This makes it ideal for bonding components in high-temperature environments.

Chemical Resistance: The polymer's aromatic structure provides excellent resistance to chemicals, including acids, bases, and solvents, ensuring that bonds remain intact even in corrosive environments.

Electrical Insulation: With its low dielectric constant and high volume resistivity, polyimide resin powder is also widely used in electrical and electronic applications where insulation is critical.

Adhesion and Flexibility: Despite its rigidity at high temperatures, polyimide resin powder can be formulated to provide excellent adhesion to a variety of substrates, including metals, ceramics, and glass.

Technical Indicator

Appearance Melting point Partical Size Flowability Gel time

Yellow powder 80-110℃ 200-1000 mesh 8-20mm 100-600 S

Applications of Polyimide Resin Powder

The versatility of polyimide resin powder manufactured by Yangchen Tech is evident in its wide range of applications:

Aerospace Industry: Used in bonding components of aircraft and spacecraft where exposure to extreme temperatures is common.

Electronic Manufacturing: Employed in the production of printed circuit boards (PCBs), connectors, and other electronic components that require high thermal stability.

Automotive Industry: Utilized in the manufacturing of heat-resistant adhesives for engine components and exhaust systems.

Industrial Coatings: Applied as a protective coating in high-temperature industrial environments to prevent corrosion and wear.

The Advantages of Using Polyimide Resin Powder

Compared to traditional adhesives, polyimide resin powder offers several advantages:

Outstanding Thermal Durability: Unlike epoxy or silicone-based adhesives, polyimide resin powder does not soften or degrade at high temperatures.

Long-Term Reliability: Its chemical and thermal stability ensures that bonds remain strong and intact over time, reducing the need for frequent repairs or replacements.

Design Flexibility: Can be formulated to meet specific application requirements, offering a tailored solution for unique challenges.

Polyimide resin powder, with its thermal stability and versatility, plays a central role in advanced composites and high-temperature fuel cells.For any application where high-temperature stability and reliability are paramount, polyimide resin powder is the premier choice. Its unique combination of thermal, chemical, and mechanical properties makes it an indispensable material for manufacturing. Whether you're seeking to improve the performance of your current products or exploring new design possibilities, polyimide resin powder is the solution you need. Welcome Inquiry!

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2025-04-18

Aluminum nitride Why is it more expensive than other substrates, but difficult to find?

With the advent of the information technology revolution, the integrated circuit industry has developed rapidly. The increasing integration density of electronic systems leads to higher power density and greater heat generation from electronic components and the system as a whole. Therefore, effective electronic packaging must address the heat dissipation issues of electronic systems.

In this context, ceramic substrates, with their excellent heat dissipation performance, have seen a rapid surge in market demand. Particularly for aluminum nitride (AlN) ceramic substrates, despite their significantly higher prices compared to other substrates, they remain in short supply, even to the point of being "hard to find." Why is this?

The reasons are simple. The author believes there are three main points:①Superior performance, worth the price②Challenging production process③Rapid market growth.

Today, we will delve deeper into these three aspects to better understand AlN ceramic substrates.

01 Outstanding Thermal Conductivity

First, ceramic packaging substrates primarily rely on the material's high thermal conductivity to transfer heat away from the chip (heat source) and facilitate heat exchange with the external environment. For power semiconductor devices, packaging substrates must meet the following requirements:

High thermal conductivity to meet heat dissipation needs.

Excellent heat resistance to withstand high-temperature applications (above 200°C).

Matched coefficient of thermal expansion (CTE) with chip materials to reduce thermal stress in packaging.

Low dielectric constant for high-frequency performance, reducing signal transmission delay and improving speed.

High mechanical strength to meet the mechanical performance requirements during packaging and application.

Good corrosion resistance to withstand strong acids, alkalis, boiling water, organic solvents, etc.

Dene structure to meet the hermetic sealing requirements of electronic devices.

So, how does aluminum nitride perform? As a ceramic substrate material, AlN ceramic parts boast high thermal conductivity, high strength, high resistivity, low density, low dielectric constant, non-toxicity, and a CTE matching Si. These properties make it one of the most promising high temperature ceramic materials.

02 Complex and Tedious Production Process

The production of AlN ceramic substrates is highly complex and tedious, primarily reflected in two aspects: the preparation of high-end AlN powder and the fabrication of the substrates. Let’s explore these two areas separately.

1. Aluminum Nitride Powder

The quality of almost all industrial ceramic products is heavily influenced by the raw material quality, and AlN ceramic substrates are no exception.

(1) Powder Preparation Methods

As a high-performance powder material, researchers worldwide continue to innovate to address technical challenges in existing processes while exploring new, more efficient preparation methods. Currently, the most widely used industrial methods are carbothermal reduction and direct nitridation, which are mature, simple, and yield high-quality products.

(2) Multiple Factors Affect Powder Performance

The performance of AlN ceramic products depends directly on the characteristics of the raw powder, particularly its most valuable property—thermal conductivity. Key factors influencing thermal conductivity include:oxygen and other impurity content,sintering density,microstructure.These factors are reflected in the AlN powder’s purity, particle size, and shape.

(3) Hydrolysis Sensitivity and the Need for Modification

Despite its excellent properties, AlN powder has a major drawback: it is highly prone to hydrolysis. In humid environments, it readily reacts with hydroxyl groups in water to form aluminum hydroxide, creating an alumina layer on the surface. This layer dissolves oxygen into the lattice, reducing thermal conductivity and altering physicochemical properties, complicating its application.

The current solution is to coat the aluminum nitride particles with a substance that isolates them from water, preventing hydrolysis. Methods to inhibit hydrolysis include:surface chemical modification,surface physical coating.

2. Substrate Fabrication

(1) Ceramic Substrate Forming

The primary method for preparing AlN ceramic substrates is tape casting.

(2) Critical Step—Sintering

Sintering is a crucial step in AlN substrate preparation.Pressureless sintering is the most common for AlN substrates due to its simplicity and low cost, but it typically requires high temperatures and sintering aids to achieve high performance.

The uniformity of sintering temperature in the furnace significantly impacts AlN ceramics. Research into temperature uniformity supports mass production, cost reduction, and commercialization.

For dense ceramic sintering, adding sintering aids is the most economical and effective method.These materials serve two purposes during sintering:

They react with surface Al₂O₃ to form liquid aluminates, promoting mass transfer via viscous flow. This adjusts particle contact angles, fills pores, and enhances densification.They react with oxygen, reducing lattice oxygen content.

In reducing atmospheres, sintering time and temperature must be carefully controlled to prevent AlN reduction. Neutral atmospheres (e.g., N₂) avoid this issue, making them preferable for producing high-performance AlN ceramics.

About Xiamen Juci Technology Co., Ltd.

Xiamen Juci Technology Co., Ltd. is a high-tech enterprise specializing in the research, development, production, and sales of high-performance ceramic materials. As a leading AlN substrate manufacturer, the company is committed to providing high-quality aluminum nitride series products and solutions for industries such as electronics, semiconductors, and aerospace. With exceptional quality and service, Xiamen Juci has earned widespread trust from global customers.

Media Contact:
Xiamen Juci Technology Co., Ltd.

Phone: +86 592 7080230
Email: miki_huang@chinajuci.com
Website: www.jucialnglobal.com

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2025-04-11

Carboxylated Polyvinyl Alcohol (CPVA)

I. Definition of Carboxylated Polyvinyl Alcohol (CPVA)
Carboxylated polyvinyl alcohol is a hydrogen-modified polymer obtained through a carboxylation reaction based on polyvinyl alcohol (PVA). CPVA has typically higher solubility and better performance than unmodified PVA.

II. Functions of Carboxylated Polyvinyl Alcohol

Plasticizer
CPVA can be used as a plasticizer to improve the processing properties and flexibility of plastics. It is often used in the production of soft plastics, coatings, and rubber products.

Adhesive
CPVA can act as an adhesive, forming strong bonds between different materials. For example, when used as glue, it can bond materials such as paper, wood, and plastic together.

Lubricant
CPVA can function as a lubricant, reducing friction on contact surfaces and extending the lifespan of materials. It is commonly used in industrial applications such as metalworking, textile manufacturing, and plastic processing.

III. Applications of Carboxylated Polyvinyl Alcohol

Packaging Materials
CPVA is used in manufacturing food packaging materials, such as wrapping paper, plastic films, and straws. This polymer is not only safe and environmentally friendly but also provides excellent flexibility and water resistance, offering effective protection for food packaging.

Paper Coating
CPVA is used to coat paper, enhancing its strength and water resistance. It is commonly applied in the production of books, magazines, and other paper-based products.

Medical Field
CPVA is used to manufacture medical products, such as sutures and artificial cartilage. It has good biocompatibility and poses no adverse effects when in contact with human tissues, ensuring the safety and reliability of medical materials.

Conclusion
Carboxylated polyvinyl alcohol is a multifunctional material with applications as a plasticizer, adhesive, and lubricant. It is widely used in packaging materials, paper coatings, and the medical field.

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2025-04-11

EVOH materials the future of environmentally friendly packaging

EVOH (Ethylene Vinyl Alcohol Copolymer) is considered to be a more environmentally friendly material, mainly in terms of its advantages in reducing food waste, prolonging product freshness, and in the recycling process.EVOH's gas barrier properties are excellent, and it can effectively prevent oxygen, water vapor, and other substances from entering into the package, thus prolonging the shelf-life of the food, and reducing food spoilage and waste. This feature makes EVOH particularly important in food packaging, and can significantly reduce the environmental burden caused by food expiration or spoilage.

In addition, EVOH has good recyclability, and although its recyclability is not as good as that of materials such as PE (polyethylene) and PP (polypropylene), it can be used in combination with these materials to take advantage of the strengths of both materials; PE and PP have better mechanical strength and chemical resistance, while EVOH provides a better barrier to gases. Through composite use, this multi-layer packaging material ensures packaging functionality while allowing for easier disposal during recycling, helping to reduce resource waste.

What's more, EVOH is produced in a relatively environmentally friendly manner and does not release harmful substances during its use. Compared to other traditional plastic materials, the use of EVOH reduces the need for chemical additives, further minimizing the impact on the environment. Therefore, EVOH is playing an increasingly important role in promoting green packaging and circular economy, becoming an environmentally friendly and sustainable packaging material.

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2025-04-11

Properties and Applications of Polyvinyl Butyral (PVB) Resin

Polyvinyl butyral (PVB)https://www.elephchem.com/https://www.elephchem.comhttps://www.elephchem.comwww.elephchem.comhttps://www.elephchem.compolyvinyl-butyral-resin is a condensation product of polyvinyl alcohol (PVAL) and butyraldehyde, appearing as a white powder. It is soluble in alcohols (e.g., methanol, ethanol, butanol), ketones (e.g., butanone, cyclohexanone), chlorinated hydrocarbons (e.g., chloroethane, dichloroethane), and aromatic hydrocarbons (e.g., benzene, toluene, xylene), and is highly soluble in alcohol-benzene mixed solvents. PVB exhibits excellent compatibility with plasticizers such as phthalate and sebacate esters, as well as with nitrocellulose, phenolic resin, and epoxy resin. It possesses high transparency, excellent cold resistance, impact resistance, and UV resistance, along with strong adhesion to metals, glass, wood, ceramics, and fiber products.

PVB is typically manufactured by first dissolving PVAL in water, then adding butyraldehyde and a catalyst (e.g., hydrochloric or sulfuric acid) under stirring, maintaining a reaction temperature of 15–50°C for the acetalization process. The resulting product is washed, centrifuged, and dried to obtain the final product. PVB is primarily used in the production of interlayer films for laminated glass (e.g., safety glass, bulletproof glass), as well as in coatings (e.g., phosphating primers, metal coatings, wood coatings, and vacuum metallization coatings) and adhesives.

Currently, global PVB resin production is concentrated in the United States, Western Europe, and Japan, with the U.S. being the largest producer and consumer. China's PVB industry began in the 1950s but developed slowly until breakthroughs in ceramic decals and vacuum aluminum plating applications during the Seventh Five-Year Plan (1986–1990), which spurred industry growth. The primary use of PVB resin is as a high-viscosity raw material for PVB films, which serve as interlayers in safety glass. Additionally, it is widely used in coatings, adhesives, ceramic decals, and aluminum foil paper.

PVB films are specialized products for manufacturing safety glass and bulletproof glass. Safety glass, made by sandwiching a PVB film between two layers of ordinary glass, offers excellent low-temperature impact strength, flexibility, light transmittance, weather resistance, sound insulation, and UV blocking. When subjected to strong external impact, the PVB film absorbs energy, preventing glass breakage or fragmentation injuries. PVB-laminated safety glass also features high transparency, water resistance, and aging resistance, with usability down to -60°C. It can also replace acrylic as a transparent material. Multi-layer lamination of glass and PVB films enables the production of military-grade bulletproof glass.

PVB contains hydroxyl, acetyl, and aldehyde groups, giving it strong adhesive properties, making it suitable for various adhesives such as glass adhesives, metal adhesives, enameled wire adhesives, heat-seal adhesives, transfer label adhesives, film adhesives, pressure-sensitive adhesives, and others.

With rising living standards, demand for filter-tipped cigarettes has surged. To protect public health, health authorities mandate 100% tipping for premium cigarettes, leading to a sharp increase in tipping paper usage and, consequently, PVB adhesive consumption.

Furthermore, PVB resin can be blended with other resins to enhance bonding performance, creating adhesives for diverse applications, including wood, ceramics, metals, plastics, and leather.

Due to its high bond strength, cold resistance, oil resistance, wear resistance, and corrosion resistance, PVB is widely used in wood coatings, metal coatings, metal primers, metal inks, foil coatings, vacuum metallization coatings, concrete coatings, waterproof coatings, leather coatings, and glossy surface protective coatings.

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2025-04-11

Status and Prospect of EVOH Material Development in China

By the end of 2023, China's annual EVOH consumption will be about 30,000 tons, but more than 90% of it is dependent on imports, mainly from international giants such as Japan Kuraray (Kuraray) and Japan Synthesis Chemical (JSR).

Chuanwei Chemical (a subsidiary of SINOPEC) is currently the closest to the industrialized production of EVOH enterprises, has built an annual output of 12,000 tons of EVOH (including EVOH EW-3201 and EVOH EW-3801) production equipment, and plans to add 24,000 tons of new production capacity in the future, with a total production capacity of 36,000 tonshttps://www.elephchem.comyear, which is expected to be the first enterprise to achieve large-scale production in China.

Dalian Institute of Chemical Physics, Chinese Academy of Sciences, has developed an EVOH preparation method based on alkaline deep eutectic solvent, which reduces the separation cost, improves the product purity and provides technical support for the localization of EVOH.

Shenzhen Institute of Advanced Polymer Research has successfully developed EVOH resins with performance comparable to that of international first-class products through continuous polymerization technology and polymer chain segment micro-regulation technology, filling the gaps in domestic technology.

Policy support: the national “14th Five-Year Plan” clearly puts forward to strengthen the independent research and development of high-end polymer materials, EVOH as a high-performance barrier material, by the policy encouragement and industrial funding support.

Market prospect: It is expected that after 2025, with the commissioning of domestic enterprises such as Chuanwei Chemical, the annual production capacity of EVOH in China is expected to exceed 50,000 tons, which will significantly reduce the dependence on imports, and some of the products may even be exported to the international market.

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CAS 10563-26-51
CAS 11138-66-21
CAS 1414-45-51
CAS 2386-87-01
CAS 2579-20-61
CAS 462-94-21
CAS 61788-44-12
CAS 63738-22-71
CAS 67784-74-11
CAS 70-18-81
CAS 7512-17-61
CAS 7681-93-81
CAS 9004-61-91
CAS 9005-38-31
CAS 941-69-51
CAS NO :67784-74-11
CAS NO. 1094-61-71
CAS NO. 8041-44-91
CAS:13676-54-51
CAS:3006-93-71
CAS:63148-65-22
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Car cleaning agent defoamer1
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Corrosion resistant chemical pump2
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Di(2-hydroxyethyl)methyldodecylammonium chloride1
Di(hydrogenated tallow)dimethylammonium chloride1
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Dicyandiamide1
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Didodecyl dimethyl ammonium bromide1
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Dimethyl didodecyl ammonium bromide 80%1
Dimethyldidodecylaminium·chloride1
Dimethyldioctadecylammonium bromide1
Dioctadecyl dimethyl ammonium bromide1
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Dispersible polymer powde1
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Distearyl dimethyl ammonium bromide1
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DiverSol 6281
DiverSol 6881
DiverSol 7771
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Docosyl trimethyl ammonium chloride1
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Dodecyl di(2-hydroxyethyl)methyl ammonium chloride1
Dodecyl di(2-hydroxyethyl)methyl ammonium chloride 22340-01-81
Dodecyl trimethyl ammonium bromide 50%1
Dodecylbis(2-hydroxyethyl)methylammonium chloride1
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Double Sided EVA Foam Tape1
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Durable PVA Fiber1
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ECO VAE 16081
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EXCEVAL AQ-41042
Eastman Butvar B-901
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Eco friendly shoe sole material1
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Fish Oil1
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HVA-22
HVA-2 Curing Agent1
HY9601
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Herbicide defoamer1
Hexadecyl dimethyl benzyl ammonium chloride1
Hexion Bakelite PF 65071
High Barrier Film1
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Hot sale Tetramethyl ammonium hydroxide 25% in water/methanol solution1
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K541
KH-301
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Low purity Tetramethylammonium Chloride2
MSP1
MSP-2501
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Manufacturing processes1
Marble Demoulding PVA Film1
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Medical applications of polyvinyl alcohol1
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Melatonin Powder1
Methoxypoly(ethylene glycol)1
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Methoxypoly(ethylene glycol) succinimidyl carbonate1
Methoxypoly(ethylene glycol) thiol1
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N,N,N-tributyl-1-butanaminium tetrafluorophosphate1
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N,N‘-(4,4’ DIPHENYLMETHANE)BISMALEIMIDE1
N,N′-m-phenylene Bismaleimide1
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