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Want to mix aluminum nitride (AlN) filler, a high-thermal-conductivity ceramic powder, into epoxy resin to make thermally conductive materials? Simply blending them in often yields …
Today, with the continuous increase in the power density of electronic devices, heat dissipation has become one of the key bottlenecks restricting technological development. …
In the field of thermal interface materials (TIM), long-term reliability is one of the core metrics for evaluating product performance, and the choice of filler directly determines …
In modern electronic devices, Thermal Interface Materials (TIMs) play a crucial role. They not only need to transfer heat efficiently but also must possess sufficient mechanical …
Under the trend of miniaturization and high-powerization of electronic devices, heat dissipation has become a key bottleneck for performance improvement. The core to solving this …